Thermal-elasto-plastic analysis of W-Cu functionally graded materials subjected to a uniform heat flow by micromechanical model

Journal of Thermal Stresses

Volumn 23, Issue 4, 2000, Pages 395-409

  Ueda, S ^a   Gasik, M ^b  

^a OSAKA INSTITUTE OF TECHNOLOGY   (Japan)

^b AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOPLASTICITY; STRAIN; STRESS CONCENTRATION; THERMOELASTICITY;

THERMONUCLEAR FUSION PROCESS;

FUNCTIONALLY GRADED MATERIALS;

EID: 0034350446     PISSN: 01495739     EISSN: None     Source Type: Journal    
DOI: 10.1080/014957300280380     Document Type: Article

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