Prediction of the tensile load-bearing capacity of a co-cured single lap joint considering residual thermal stresses

Journal of Adhesion Science and Technology

Volumn 14, Issue 13, 2000, Pages 1691-1704

  Shin, Kum Cheol ^a   Lee, Jung Ju ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Bond length; Co cured single lap joint; Interfacial stresses; Residual thermal stresses; Stacking sequence; Tensile load bearing capacity; Ye delamination failure criterion

Indexed keywords

BONDING; CURING; DELAMINATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LOAD TESTING; RESIDUAL STRESSES; STRESS CONCENTRATION; TENSILE STRENGTH; THERMAL STRESS; THICKNESS MEASUREMENT; BEARING CAPACITY; BOND LENGTH; TENSILE STRESS;

COHESIVE FAILURE; DELAMINATION FAILURE CRITERION; FAILURE MECHANISM; RESIDUAL THERMAL STRESS; SINGLE LAP JOINT; TENSILE LOAD-BEARING CAPACITY;

ADHESIVE JOINTS; CURING;

CO-CURED; INTERFACIAL STRESSES; LOAD-BEARING CAPACITY; RESIDUAL THERMAL STRESS; STACKING SEQUENCE; YE-DELAMINATION FAILURE CRITERION;

EID: 0034458525     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856100742492     Document Type: Article

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