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Volumn 18, Issue 2, 2005, Pages 119-152

Thermal residual stress analysis of Ni-Al2O3, Ni-TiO2, and Ti-SiC functionally graded composite plates subjected to various thermal fields

Author keywords

Functionally graded plates; Layered finite element; Thermal residual stress

Indexed keywords

ALUMINA; DEGREES OF FREEDOM (MECHANICS); FINITE ELEMENT METHOD; FUNCTIONALLY GRADED MATERIALS; NICKEL; PLATES (STRUCTURAL COMPONENTS); RESIDUAL STRESSES; SHEAR STRESS; SILICON CARBIDE; STRESS ANALYSIS; TENSILE STRESS; THERMAL EXPANSION; THERMAL STRESS; TITANIUM DIOXIDE;

EID: 17444413777     PISSN: 08927057     EISSN: None     Source Type: Journal    
DOI: 10.1177/0892705705043534     Document Type: Article
Times cited : (28)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.