Fluxless soldering of copper substrates using self-assembled monolayers for preservation

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 512-521

  Liu, Changqing ^a   Hutt, David A ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Copper; Fluxless soldering; Octadecanethiol; Self assembled monolayers (SAMs)

Indexed keywords

COPPER; MONOLAYERS; OXIDATION; SELF ASSEMBLY; X RAY PHOTOELECTRON SPECTROSCOPY;

FLUXLESS SOLDERING; OCTADECANETHIOL; SELF-ASSEMBLED MONOLAYERS (SAMS);

SOLDERING;

EID: 33748551014     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853177     Document Type: Article

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