Fluxless flip-chip bonding on flexible substrates: A comparison between adhesive bonding and soldering

Soldering and Surface Mount Technology

Volumn , Issue 23, 1996, Pages 5-11

  Aschenbrenner, R ^a   Zakel, E ^a   Azdasht, G ^b   Kloeser, A ^a   Reichl, H ^a  

^a Abt Mechanische Zuverlassigkeit M   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; INTERCONNECTION NETWORKS; LASER BEAMS; MICROPROCESSOR CHIPS; SOLDERING; THERMAL EXPANSION; ELECTROPLATING; EUTECTICS; GOLD; LASER APPLICATIONS; METALLURGY; POLYIMIDES; SUBSTRATES; TIN;

FLEXIBLE SUBSTRATES; FLIP-CHIP BONDING; LASER BASED SYSTEMS; ORGANIC SUBSTRATES; EUTECTIC ALLOY; INNER LEAD BONDING PROCESS; LASER SOLDERING;

FLIP CHIP DEVICES;

EID: 0030173031     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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