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Volumn 7, Issue 4, 1998, Pages
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Flux-free placement and attach of solder spheres
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Author keywords
[No Author keywords available]
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Indexed keywords
COST EFFECTIVENESS;
FLIP CHIP DEVICES;
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DEVICE STRUCTURES;
SOLDERED JOINTS;
SOLDERING;
FLUX FREE PLACEMENT;
SOLDER SPHERES;
WAFERS;
ELECTRONICS PACKAGING;
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EID: 0032075421
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (2)
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References (0)
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