Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 172-186

  Takyi, G ^a   Ekere, N N ^a   Philpott, J D ^a   Snowdon, K G ^b   Tanner, C G ^b  

^a UNIVERSITY OF SALFORD   (United Kingdom)

^b NORTEL NETWORKS   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; CHEMICAL ANALYSIS; CHEMICAL CLEANING; CONTACT ANGLE; DROPS; INDUSTRIAL ELECTRONICS; INERT GASES; MOLECULAR OXYGEN; NITROGEN; ORGANIC CARBON; ORGANIC CHEMICALS; ORGANIC POLLUTANTS; PRINTED CIRCUIT BOARDS; SOLDERING; VOLATILE ORGANIC COMPOUNDS; WETTING;

CHEMICAL ETCHING; FLUX-LESS SOLDERING; NITROGEN ATMOSPHERES; PARTS PER MILLIONS; PHYSICAL SPUTTERING; SOLDERING PERFORMANCE; VOLATILE ORGANIC COMPOUND (VOC); WETTING BALANCE;

NITROGEN PLASMA;

EID: 1642620140     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731073     Document Type: Conference Paper

References (13)

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