Wafer scale photonic-die attachment

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 2, 1998, Pages 136-139

  Boudreau, Robert ^a   Zhou, Ping ^b   Bowen, Terry ^a  

^a AMP Inc   (United States)

^b HONEYWELL   (United States)

Author keywords

Diebonding; Fiberoptics; Manufacturing; Passive optical alignment; Silicon optical bench; Silicon waferboard

Indexed keywords

BONDING; FIBER OPTICS; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; WSI CIRCUITS;

DIEBONDING; PASSIVE OPTICAL ALIGNMENT; SILICON OPTICAL BENCH; SILICON WAFERBOARD;

ELECTRONICS PACKAGING;

EID: 0032072982     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.673700     Document Type: Article

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