Surface coatings for fluxless soldering of copper

Circuit World

Volumn 29, Issue 1, 2002, Pages

  Liu, Changqing ^a   Hutt, David A ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Interconnection; Soldering

Indexed keywords

CLEANING; COPPER; COSTS; FLUXES; ORGANIC COATINGS; OXIDATION; PRINTED CIRCUIT BOARDS;

OXIDE LAYERS;

SOLDERING;

EID: 18644364682     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310444151     Document Type: Article

References (9)

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8. Nangalia, S., Koopman, N., Rogers, V., Beranek, M.W., Hager, H.E., Ledbury, E.A., Loebs, V.A., Miao, E.C., Tang, C.H., Pico, C.A., Swenson, E.J., Hatzis, D., Li, P. and Luck, C. (1997), "Fluxless, no clean assembly of optoelectronic devices with PADS", 47th Electronic Components and Technology Conference (ECTC), pp. 755-62.
9. Ramos, R. (2000), "Void-free, flux-free process for placement and attach of solder balls", Advanced Packaging, pp. 52-8.