Integration of simulation and response surface methods for thermal design of multichip modules

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 359-372

  Cheng, Hsien Chie ^a   Chen, Wen Hwa ^b   Chung, I Chun ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC POWER SUPPLIES TO APPARATUS; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; MULTICHIP MODULES; STATISTICAL TESTS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

CHIP JUNCTION TEMPERATURE; INFRARED RADIATION THERMOGRAPHY; RESPONSE SURFACE METHODS; THERMAL CHARACTERIZATION; THERMAL DESIGN; THERMAL TEST DIE MEASUREMENT; UNCERTAINTY ANALYSIS;

CHIP SCALE PACKAGES;

EID: 3242772149     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828560     Document Type: Article

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