An effective thermal-mechanical modeling methodology for large-scale area array typed packages

CMES - Computer Modeling in Engineering and Sciences

Volumn 7, Issue 1, 2005, Pages 1-17

  Cheng, H C ^a   Yu, C Y ^b   Chen, W H ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Area array typed package; Fatigue life; Global local FE approach; Moir interferometry

Indexed keywords

ELASTOPLASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFEROMETRY; MATHEMATICAL MODELS; SOLDERED JOINTS; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

AREA ARRAY TYPED PACKAGE; GLOBAL/LOCAL FINITE ELEMENT (GLFE) APPROACH; MOIRE INTERFEROMETRY; TEMPERATURE CYCLING;

ELECTRONICS PACKAGING;

EID: 13244249896     PISSN: 15261492     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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