Nitride-based flip-chip LEDs with transparent ohmic contacts and reflective mirrors

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 403-408

  Chang, S J ^a   Chen, W S ^a   Lin, Y C ^a   Chang, C S ^a   Ko, T K ^a   Hsu, Y P ^a   Shen, C F ^a   Tsai, J M ^b   Shei, S C ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b South Epitaxy Corporation   (Taiwan)

Author keywords

Flip chip; GaN; Light emitting diodes (LED); Refletive mirrors; Transparent ohmic contact

Indexed keywords

FLIP CHIP DEVICES; MIRRORS; NITRIDES; OHMIC CONTACTS; REFLECTION; SEMICONDUCTING GALLIUM COMPOUNDS;

FABRICATED FLIP-CHIP; REFLECTIVE MIRRORS; TRANSPARENT OHMIC CONTACT;

LIGHT EMITTING DIODES;

EID: 33747599183     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.871189     Document Type: Article

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