-
1
-
-
0030270183
-
Silicon carbide high-power devices
-
Weitzel C.E., Palmour J.W., Carter Jr. C.H., Moore K., Nordquist K.K., Allen S., et al. Silicon carbide high-power devices. IEEE Trans Electron Dev 43 (1996) 1732
-
(1996)
IEEE Trans Electron Dev
, vol.43
, pp. 1732
-
-
Weitzel, C.E.1
Palmour, J.W.2
Carter Jr., C.H.3
Moore, K.4
Nordquist, K.K.5
Allen, S.6
-
2
-
-
0027558366
-
Comparison of 6H-SiC, 3C-SiC, and Si for power devices
-
Bhatnagar M., and Baliga B.J. Comparison of 6H-SiC, 3C-SiC, and Si for power devices. IEEE Trans Electron Dev 40 (1993) 645
-
(1993)
IEEE Trans Electron Dev
, vol.40
, pp. 645
-
-
Bhatnagar, M.1
Baliga, B.J.2
-
5
-
-
84964533578
-
-
Zhang Y, Yimen Z, Niu X. The study of Ni/4H-SiC SBD. In: Proceedings of 6th international solid-state and integrated-circuit technology, 2001. p. 1187.
-
-
-
-
6
-
-
0032121583
-
Design considerations and experimental analysis of high-voltage SiC Schottky barrier rectifier
-
Schoen K.J., Woodall J.M., Cooper J.A., and Melloch M.R. Design considerations and experimental analysis of high-voltage SiC Schottky barrier rectifier. IEEE Trans Electron Dev 45 (1998) 1595
-
(1998)
IEEE Trans Electron Dev
, vol.45
, pp. 1595
-
-
Schoen, K.J.1
Woodall, J.M.2
Cooper, J.A.3
Melloch, M.R.4
-
8
-
-
0035744651
-
-
Biserica O, Godignon P, Brezeanu G, Badila M, Rebollo J. Design of a reliable planar edge termination for SiC power devices. In: Proceedings of international semiconductor conference, CAS 2001, 2001; vol. 2, p. 353.
-
-
-
-
9
-
-
0033096736
-
Insulator investigation on SiC for improved reliability
-
Lipkin L.A., and Palmour J.W. Insulator investigation on SiC for improved reliability. IEEE Trans Electron Dev 46 (1999) 525
-
(1999)
IEEE Trans Electron Dev
, vol.46
, pp. 525
-
-
Lipkin, L.A.1
Palmour, J.W.2
-
10
-
-
0010728564
-
Electrical characteristics of metal/AlN/n-type 6H-SiC(0 0 0 1) heterostructures
-
Aboelfotoh M.O., Kern R.S., Tanaka S., Davis R.F., and Harris C.I. Electrical characteristics of metal/AlN/n-type 6H-SiC(0 0 0 1) heterostructures. Appl Phys Lett 69 (1996) 2873
-
(1996)
Appl Phys Lett
, vol.69
, pp. 2873
-
-
Aboelfotoh, M.O.1
Kern, R.S.2
Tanaka, S.3
Davis, R.F.4
Harris, C.I.5
-
11
-
-
0035855013
-
3 gate stacks on SiC metal-oxide-semiconductor devices
-
3 gate stacks on SiC metal-oxide-semiconductor devices. Appl Phys Lett 79 (2001) 973
-
(2001)
Appl Phys Lett
, vol.79
, pp. 973
-
-
Lazar, H.R.1
Misra, V.2
-
12
-
-
0036923577
-
-
McPherson J, Kim, J, Shanware A, Mogul H, Rodriguez J. Proposed universal relationship between dielectric breakdown and dielectric constant, Electron Devices Meeting, 2002. p. 633.
-
-
-
-
15
-
-
0037397145
-
A numerical comparison between MOS control and junction control high voltage devices in SiC technology
-
Mihaila A., Udrea F., Brezeanu G., and Amaratunga G. A numerical comparison between MOS control and junction control high voltage devices in SiC technology. Solid-State Electron 47 (2003) 607
-
(2003)
Solid-State Electron
, vol.47
, pp. 607
-
-
Mihaila, A.1
Udrea, F.2
Brezeanu, G.3
Amaratunga, G.4
-
18
-
-
4544378779
-
Enhancement of breakdown voltage for Ni-SiC Schottky diodes using field plate edge termination
-
Ayalew T., Gehring A., Grasser T., and Selberherr S. Enhancement of breakdown voltage for Ni-SiC Schottky diodes using field plate edge termination. J Microelectron Reliab 44 (2004) 1473
-
(2004)
J Microelectron Reliab
, vol.44
, pp. 1473
-
-
Ayalew, T.1
Gehring, A.2
Grasser, T.3
Selberherr, S.4
-
19
-
-
18444362481
-
Silicon dioxide and silicon nitride as a passivation and edge termination for 4H-SiC Schottky diodes
-
Mariusz S., Radoslaw L., Witold R., Aleksander W., Jan S., and Elzbieta S. Silicon dioxide and silicon nitride as a passivation and edge termination for 4H-SiC Schottky diodes. Diam Relat Mater 14 (2005) 1138
-
(2005)
Diam Relat Mater
, vol.14
, pp. 1138
-
-
Mariusz, S.1
Radoslaw, L.2
Witold, R.3
Aleksander, W.4
Jan, S.5
Elzbieta, S.6
-
20
-
-
0035478596
-
Lateral current spreading in SiC Schottky diodes using metal overlap edge termination
-
Zhang Q., and Sudarshan T.S. Lateral current spreading in SiC Schottky diodes using metal overlap edge termination. Solid-State Electron 45 (2001) 1847
-
(2001)
Solid-State Electron
, vol.45
, pp. 1847
-
-
Zhang, Q.1
Sudarshan, T.S.2
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