Electrochemical deposition of copper and ruthenium on titanium

Electrochimica Acta

Volumn 51, Issue 25, 2006, Pages 5445-5451

  Kim, Young Soon ^a   Kim, Hyung Il ^a   Cho, Joong Hee ^a   Seo, Hyung Kee ^a   Kim, Gil Sung ^a   Ansari, S G ^a   Khang, Gilson ^a   Senkevich, Jay J ^b   Shin, Hyung Shik ^a  

^a Chonbuk National University   (South Korea)

^b BREWER SCIENCE INC   (United States)

Author keywords

Copper; Electrochemical deposition; Ruthenium seed layer; Rutherford backscattering spectrometry

Indexed keywords

COPPER; ELECTRODEPOSITION; HYDROCHLORIC ACID; POLYETHYLENE GLYCOLS; RUTHENIUM; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SULFURIC ACID; THIN FILMS;

DEPTH PROFILING; ELECTROCHEMICAL DEPOSITION; MEAN SQUARE ROUGHNESS; RUTHENIUM SEED LAYER;

ELECTROCHEMISTRY;

EID: 33746025914     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.02.016     Document Type: Article

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