Direct Plating of Cu on Ruthenium for sub-45nm Technology Node Interconnects Gapfill

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 539-544

  Johnston, Steve ^a   Chebiam, Ramanan ^a   Simka, Harsono ^a   Fischer, Paul ^a   Dubin, Val ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM THICKNESS; RESISTIVE LINERS; SHEET RESISTANCE; WAFER PATTERNING;

ANODES; COPPER; DIFFUSION; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; OPTIMIZATION; PHYSICAL VAPOR DEPOSITION; RUTHENIUM; SHEET METAL; WAVEFORM ANALYSIS;

ELECTROPLATING;

EID: 23844514405     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. International Technology Roadmap for Semiconductors, 2002 update, Sematech International
2. Y. Zhang, L. Huang, T.N. Arunagiri, O. Ojeda, S. Flores, O. Chyan, and R.M. Wallace, Electro, and Solid State Letters, v7, p. C107-110 (2004)
3. Q. Wang, J.G. Ekerdt, D. Gay, Y.-M. Sun, and J.M. White, Appl. Phys. Letters, v84, p1380-1382 (2004)
4. S. Johnston, D. Feller, V. Dubin, and P. Moon, Adv. Metallization Conf., 2003, p.335-340
5. V. M. Dubin, R. Brewer, H. Shankar, and S. Shankar, Future Fab. Int. 13, p.244 (2002)
6. H. Simka, R. Chalupa, V. M. Dubin, and S. Shankar, Amer. Vac. Soc. 49th Int. Symp., Denver, CO, 2002
7. V. M. Dubin, C.C. Cheng, S. Johnston, R. Chebiam, J. Dominguez, A. Fajardo, M. Fang, H. Simka, R. Chalupa, T. Zhong, and S. Shankar, to be presented at ECS Joint International Meeting, Honolulu, Hawaii, 2004