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Volumn 46, Issue 3, 1997, Pages 321-336
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The current density distribution on stationary wire electrodes during copper and lead electrodeposition
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Author keywords
[No Author keywords available]
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Indexed keywords
COATED WIRE ELECTRODES;
COPPER PLATING;
CURRENT DENSITY;
ELECTRIC CONDUCTIVITY OF LIQUIDS;
LEAD PLATING;
ELECTROCHEMICAL OVERPOTENTIALS;
ELECTRODEPOSITION;
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EID: 0031245572
PISSN: 0304386X
EISSN: None
Source Type: Journal
DOI: 10.1016/s0304-386x(97)00028-5 Document Type: Article |
Times cited : (8)
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References (17)
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