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Volumn 46, Issue 3, 1997, Pages 321-336

The current density distribution on stationary wire electrodes during copper and lead electrodeposition

Author keywords

[No Author keywords available]

Indexed keywords

COATED WIRE ELECTRODES; COPPER PLATING; CURRENT DENSITY; ELECTRIC CONDUCTIVITY OF LIQUIDS; LEAD PLATING;

EID: 0031245572     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0304-386x(97)00028-5     Document Type: Article
Times cited : (8)

References (17)
  • 3
    • 0003482665 scopus 로고
    • Prentice-Hall, Englewood Cliffs, NJ
    • J. Newman, Electrochemical Systems, Prentice-Hall, Englewood Cliffs, NJ, 1973, p. 319.
    • (1973) Electrochemical Systems , pp. 319
    • Newman, J.1
  • 14
    • 0003482665 scopus 로고
    • Prentice-Hall, Englewood Cliffs, NJ
    • J.S. Newman, Electrochemical Systems, Prentice-Hall, Englewood Cliffs, NJ, 1973, p. 177.
    • (1973) Electrochemical Systems , pp. 177
    • Newman, J.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.