SCOPUS 정보 검색 플랫폼

Volumn 32, Issue 4, 2003, Pages 272-277

New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects

Author keywords

Copper seed layer; Dual damascene; Ion chromatography; Metrology

Indexed keywords

CHROMATOGRAPHY; COPPER PLATING; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROPLATING; SURFACE ROUGHNESS;

COPPER SEED LAYERS;

ELECTROCHEMISTRY;

EID: 0037393625 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-003-0221-0 Document Type: Article

Times cited : (6)

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