Through-process modeling in a DfM environment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6156, Issue , 2006, Pages

  Mansfield, Scott ^a   Han, Geng ^a   Al Imam, Mohamed ^b   Fathy, Rami ^b  

^a IBM MICROELECTRONICS   (United States)

^b MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

Design for manufacturability (DfM); Optical proximity correction (OPC); Process window; Resolution enhancement techniques (RET); Through process models

Indexed keywords

DESIGN FOR MANUFACTURABILITY (DFM); OPTICAL PROXIMITY CORRECTION (OPC); PROCESS WINDOW; RESOLUTION ENHANCEMENT TECHNIQUES (RET); THROUGH-PROCESS MODELS;

LITHOGRAPHY; MATHEMATICAL MODELS; MICROELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE;

PRODUCT DESIGN;

EID: 33745804939     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.658049     Document Type: Conference Paper

References (16)

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