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Multiple stage optical proximity correction
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Optical Microlithography
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Process centering OPC using design intent to improve yield
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Michael Cote, Alex Miloslavsky, Robert Lugg, Mike Rieger, Philippe Hurat, "Process Centering OPC using Design Intent to Improve Yield", SPIE Proceedings, 2005
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Prediction of design sensitivity to AltPSM lithography across process window
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Hurat, P.1
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Using yield-focused design methodologies to speed time-to-market
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Design and Process Integration for Microelectronics Manufacturing II
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Design and Process Integration for Microelectronics Manufacturing II
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Design and Process Integration for Microelectronics Manufacturing III
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Through-process modeling in a DfM environment
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Design and Process Integration for Microelectronics Manufacturing IV
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Scott Mansfield, Geng Han, "Through-process modeling in a DfM environment", Design and Process Integration for Microelectronics Manufacturing IV, Proceedings of SPIE, vol. 6156 (2006)
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Design of integrated circuit interconnects with accurate modeling of chemical-mechanical planarization
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Design and Process Integration for Microelectronics Manufacturing III
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Lei He, Andrew B. Kahng, King Ho Tarn, Jinjun Xiong, "Design of integrated circuit interconnects with accurate modeling of chemical-mechanical planarization", Design and Process Integration for Microelectronics Manufacturing III, Proceedings of SPIE, vol. 5756, 109-119 (2005)
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