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Volumn 6154 III, Issue , 2006, Pages

Process window OPC for reduced process variability and enhanced yield

Author keywords

DfM; Lithographic process window; OPC; Process variability; Process Window OPC; Yield

Indexed keywords

DFM; LITHOGRAPHIC PROCESS WINDOW; OPTICAL PROXIMITY CORRECTION (OPC); PROCESS VARIABILITY; PROCESS WINDOW OPC; YIELD;

EID: 33745787475     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656835     Document Type: Conference Paper
Times cited : (34)

References (17)
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    • Multiple stage optical proximity correction
    • Optical Microlithography
    • Daniel Beale, James Shiely, Michael Rieger, "Multiple stage optical proximity correction", Optical Microlithography, Proceedings of SPIE XVI, vol. 5040, 1202-1209 (2003)
    • (2003) Proceedings of SPIE XVI , vol.5040 , pp. 1202-1209
    • Beale, D.1    Shiely, J.2    Rieger, M.3
  • 5
    • 33745801286 scopus 로고    scopus 로고
    • Prediction of design sensitivity to AltPSM lithography across process window
    • Pat LaCour and Nick Cobb, "Prediction of Design Sensitivity to AltPSM Lithography Across Process Window", BACUS Proceedings, 2004
    • (2004) BACUS Proceedings
    • Lacour, P.1    Cobb, N.2
  • 9
    • 33644584044 scopus 로고    scopus 로고
    • DfM for manufacturers and designers
    • th Annual BACUS Symposium on Photomask Technology
    • th Annual BACUS Symposium on Photomask Technology, Proceedings of SPIE v.5992, (2005)
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    • Hurat, P.1    Cote, M.2
  • 11
    • 25144510147 scopus 로고    scopus 로고
    • Using yield-focused design methodologies to speed time-to-market
    • Design and Process Integration for Microelectronics Manufacturing II
    • Marc Levitt, "Using yield-focused design methodologies to speed time-to-market", Design and Process Integration for Microelectronics Manufacturing II, Proc. of SPIE, vol. 5756, 13 (2005)
    • (2005) Proc. of SPIE , vol.5756 , pp. 13
    • Levitt, M.1
  • 13
    • 0242693872 scopus 로고    scopus 로고
    • Improved manufacturability by OPC based on defocus data
    • Design and Process Integration for Microelectronics Manufacturing II
    • Jorg Thiele, Ines Anke, Henning Haffher, Armin Semmler, "Improved manufacturability by OPC based on defocus data", Design and Process Integration for Microelectronics Manufacturing II, Proc. of SPIE, vol. 5042, 135 (2003)
    • (2003) Proc. of SPIE , vol.5042 , pp. 135
    • Thiele, J.1    Anke, I.2    Haffher, H.3    Semmler, A.4
  • 14
    • 25144494085 scopus 로고    scopus 로고
    • Considerations for the use of defocus models for OPC
    • Design and Process Integration for Microelectronics Manufacturing III
    • John L. Sturtevant, J.A.Torres, J.Word, Y.Granik, P.LaCour, "Considerations for the Use of Defocus Models for OPC", Design and Process Integration for Microelectronics Manufacturing III, Proc. of SPIE, vol. 5756, 427 (2005)
    • (2005) Proc. of SPIE , vol.5756 , pp. 427
    • Sturtevant, J.L.1    Torres, J.A.2    Word, J.3    Granik, Y.4    Lacour, P.5
  • 16
    • 33745804939 scopus 로고    scopus 로고
    • Through-process modeling in a DfM environment
    • Design and Process Integration for Microelectronics Manufacturing IV
    • Scott Mansfield, Geng Han, "Through-process modeling in a DfM environment", Design and Process Integration for Microelectronics Manufacturing IV, Proceedings of SPIE, vol. 6156 (2006)
    • (2006) Proceedings of SPIE , vol.6156
    • Mansfield, S.1    Han, G.2
  • 17
    • 25144432347 scopus 로고    scopus 로고
    • Design of integrated circuit interconnects with accurate modeling of chemical-mechanical planarization
    • Design and Process Integration for Microelectronics Manufacturing III
    • Lei He, Andrew B. Kahng, King Ho Tarn, Jinjun Xiong, "Design of integrated circuit interconnects with accurate modeling of chemical-mechanical planarization", Design and Process Integration for Microelectronics Manufacturing III, Proceedings of SPIE, vol. 5756, 109-119 (2005)
    • (2005) Proceedings of SPIE , vol.5756 , pp. 109-119
    • He, L.1    Kahng, A.B.2    Tarn, K.H.3    Xiong, J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.