Development of EUV resists in homogenous CO 2 solutions using CO 2 compatible salts (CCS): A kinetic view of dissolution of conventional resists in supercritical CO 2

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 II, Issue , 2006, Pages

  DeYoung, James ^a   Wagner, Mark ^a   Harbinson, Chris ^a   Miles, Merrick ^a   Zweber, Amy ^b   Carbonell, Ruben ^b  

^a Micell Integrated Systems   (United States)

^b NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

CCS; CO 2; CO 2 compatible salt; EUV; Kinetics; Mechanism; Photoresist; QCM; Supercritical

Indexed keywords

CCS; CO 2 COMPATIBLE SALT; EUV; MECHANISM; QCM; SUPERCRITICAL;

CARBON DIOXIDE; DISSOLUTION; PHOTOLITHOGRAPHY; QUARTZ; REACTION KINETICS; ULTRAVIOLET RADIATION;

PHOTORESISTS;

EID: 33745612757     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.655881     Document Type: Conference Paper

References (24)

1. Somervell, M. H.; Fryer, D. S.; Osborn, B.; Patterson, K.; Cho, S.; Byers, J. D.; Willson, C. G. Using alicyclic polymers in top surface imaging systems to reduce line-edge roughness. Proc. SPIE,. 2000, vol. 3999, p. 270.
2. Chang, S. W.; Yang, D.; Dai, J.; Felix, N.; Bratton, D.; Tsuchiya, K.; Kwark, Y. J.; Bravo-Vasquez, J. P.; Ober, C. K.; Cao, H. B.; Deng, H. Proc. SPIE, 2005, vol. 5753, p. 1.
3. Chowdury, T.; Bamnolker, H.; Khen, R.; Yang, C. L.; Lee, H. C.; Du, Y.; Shen, M.; Choi, J.; Deshmukh, S. Line-edge roughness reduction for advanced metal gate etch with 193-nm lithography in a silicon decoupled plasma source etcher (DPSII). Proc. SPIE, 2003, vol. 5039, p. 240.
4. Zhang, P.; Jaramillo, M.; Rao, M. b.; Ross, B.; Horvath, B.; Wong, P.; Gehoel, W.; Sinkwitz, S. Combined pattern collapse and LWR control at the 70 nm node through application of novel surface conditioner solutions. Proc. SPIE, 2005, vol 5753, p. 1018.
5. Zhang, P.; Jaramillo, M.; King, D. M.; Rao, M. B.; O'Brien, B. L.; ROSS, B. F. Surface conditioning solutions for pattern collapse reduction. Proc. SPIE, 2002, vol. 5376, p. 807.;
6. Junarska, I.; Stoykovich, M. P.; Yoshimoto, K.; Nealey, P. F. The use of surfactant in the rinse to improve collapse behavior of chemically amplified photoresists. Proc. SPIE, 2004, vol 5376, p. 842.
7. Peters, R. D.; Parker, C.; Cobb, J,; Luckowski, E.; Weisbrod, E.; Dauksher, B. Single-layer and bilayer resist processes for EUV-type integrations. Proc. SPIE, 2004, vol. 5376, p. 746.;
8. Jung, M. H.; Kim, H. W.; Hong, J.; Woo, S. G.; Cho, H. K.; Han, W. S. Performance of a SSQ-type ArF bilayer resist in 80-nm node DRAM line and space fabrication. Proc. SPIE, . 2004, vol. 5376, p. 1100.
9. Goldfarb, D.L.; De Pablo, J.J.; Neally, P.P.; Simons, J.P.; Moreau, W.M.; Angelopoulis, M., J. Vac. Sci. Technol. 2000, B18, 3313-3317.;
10. Namatsu, H.New supercritical resist dryer. Proc. SPIE, 2002, vol. 4688, p. 888.
11. Jones, C.A.; Yang, D.; Irene E.A.; Gross, S.M.; Wagner, M.; DeYoung; DeSimone, J. M. Chem. Mater. 2003, 15(15), p. 2867-2869.;
12. Xie, B.; Muscat, J., Microelectronic Engineering, 2005, 82, 3-4, p. 434-440;
13. Weibel, G.L.; Ober, C., Microelectronic Engineering, 2003, 65, 1-2, p. 145-152.;
14. Cabanas, A.; Long, D.P.; Watkins, J. J. Chem. Mater. 2004, 16(10), p. 2028-2033;
15. Sundararajan, N.; Yang, S.; Ogino K.; Valiyaveettil S.; Wang, J.; Zhou, X.; Ober, C.K.; Obendorf, S.K.; Allen, R.D., Chem Mater. 2000, 12, p. 41-45.;
16. Blackburn, J.M.; Long, D.P.; Watkins, J.J., Chem. Mater., 2000, 12(9), p. 2625-2631.
17. Wang, J.; Zhou, X.; Ober, C.K.; Obendorf, S.K.; Allen, R.D., Chem Mater. 2000, 12, p. 41-48.;
18. Sundararajan N; Yang, S.; Ogino, K.; Valiyaveettil, S.; Wang, J.; Zhou, X.; Ober, C. K., Chem. Mater. 2000, 12, p. 41.;
19. Pham, V. Q.; Ferris, R. J.; Hamad, A.; Ober, C. K.; Chem. Mater. 2003, 15, p. 4893.
20. Gallagher-Wetmore, P.; Wallraff, G. M.; Allen, R. D. Supercritical fluid processing: a new dry technique for photoresist developing. Proc. SPIE, 1995, vol. 2438, p. 694.;
21. United States Patents 5,665,527; 6,610,456; 6,451,510.
22. Tsiartas, P.C.; Flanagin, L. W.; Henderson, C.L.; Hinsberg, W.D.; Sanchez, I.C.; Bonnecaze, R.T.; Willson, C.G., Macromol. 1997, 30(16), p. 4556-4664.
23. Copenhafer, D. T.; Kraus, C. A.; J. Am. Chem. Soc.; 1951, 73 (10); 4557-4561.
24. Cussler, E.L.; Hunek, B., Fluid Mechanics and Transport Phenomena, 2002, 48, 661.