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Volumn 5753, Issue II, 2005, Pages 1018-1023
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Combined pattern collapse and LWR control at 70 nm node through application of novel surface conditioner solutions
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Author keywords
70nm dense lines; Line width roughness; Pattern collapse; Process window; Surface conditioner; Surfactant
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Indexed keywords
70NM DENSE LINES;
LINE WIDTH ROUGHNESS (LWR);
PATTERN COLLAPSE;
POST-DEVELOP PROCESS;
PROCESS WINDOW;
SURFACE CONDITIONER;
LITHOGRAPHY;
REDUCTION;
STANDARDS;
SURFACE ACTIVE AGENTS;
SURFACE ROUGHNESS;
WSI CIRCUITS;
ROUGHNESS MEASUREMENT;
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EID: 24644441648
PISSN: 16057422
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.600039 Document Type: Conference Paper |
Times cited : (11)
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References (8)
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