Accurately determining eutectic compositions: The Si-Ag-Cu ternary eutectic

JOM

Volumn 56, Issue 4, 2004, Pages 22-27

  Moon, K W ^a   Boettinger, W J ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; DIFFERENTIAL THERMAL ANALYSIS; EUTECTICS; INTERMETALLICS; PHASE DIAGRAMS; SILICON ALLOYS; SOLDERING ALLOYS; SUPERCOOLING; THERMODYNAMIC PROPERTIES;

CYCLED HEATING; LEAD FREE SOLDER; SILICON SILVER COPPER TERNARY EUTECTICS;

TERNARY SYSTEMS;

EID: 2442709310     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-004-0068-8     Document Type: Article

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