Performance enhancement of ring oscillators and transimpedance amplifiers by package strain

IEEE Transactions on Electron Devices

Volumn 53, Issue 4, 2006, Pages 724-729

  Yuan, Feng ^a   Huang, Ching Fang ^a   Yu, Ming Hsin ^a   Liu, Chee Wee ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Layout direction; Mechanical strain; Package strain; Ring oscillator; Strain; Transimpedance amplifier (TIA)

Indexed keywords

AMPLIFIERS (ELECTRONIC); ELECTRIC INDUCTORS; PERFORMANCE; STRAIN; STRESSES;

LAYOUT DIRECTION; MECHANICAL STRAIN; PACKAGE STRAIN; RING OSCILLATOR; TRANSIMPEDANCE AMPLIFIER (TIA);

OSCILLATORS (ELECTRONIC);

EID: 33645661314     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2006.870568     Document Type: Article

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