Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 267-270

  Tai, S F ^a   Ourdjini, A ^a   Khong, Y L ^b   Venkatesh, V C ^a   Tamin, M N ^a  

^a UNIVERSITI TEKNOLOGI MALAYSIA   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; ELECTRONICS PACKAGING; EUTECTICS; GOLD; INTERMETALLICS; LEAD; LEAD COMPOUNDS; LEAD-FREE SOLDERS; METALLURGY; MODIFIED ATMOSPHERE PACKAGING; NICKEL; NICKEL METALLURGY; PACKAGING MATERIALS; PHOSPHORUS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

ELECTROLESS NICKEL; ELECTROLESS NICKEL/IMMERSION GOLDS; GROWTH OF INTERMETALLICS; INTERMETALLIC FORMATION; PHOSPHORUS CONTENTS; SOLID-STATE AGING; STRUCTURAL EXAMINATION; UNDER-BUMP METALLURGIES;

TIN;

EID: 84966470294     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188848     Document Type: Conference Paper

References (8)

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4. Henry J., "Electroless Plating: Part II - Nickel", Metal Finishing, October, (1984), p.46.
5. Zribi, A. et al., "Aspects of the Structural Evolution of Lead-Free Solder Joints", JOM, June 2002, pp38-40.
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7. Zribi, A. et al, "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure", Journal of Elecronic Materials, Vol. 30, (2001), pp. 1157-
8. 4 in Solder Joints of Ball-Grid-Array Packages with the Au/Ni Surface Finish", Journal of Electronic Materials, vol. 29, No. 10, (2000), pp. 1175-1181.