The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronics joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 687-692

  Zribi, A ^a   Zavalij, L ^a   Borgesen, P ^a   Primavera, A ^a   Westby, G ^a   Cotts, E J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CALCULATIONS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MATHEMATICAL MODELS; NICKEL ALLOYS; REACTION KINETICS; SEMICONDUCTING INTERMETALLICS; TERNARY SYSTEMS;

ELECTRONIC JOINTS; TERNARY INTERMETALLIC ALLOYS;

SOLDERED JOINTS;

EID: 0034821701     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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