Fiber misalignment in silicon V-groove based optical modules

Optical Fiber Technology

Volumn 12, Issue 2, 2006, Pages 170-184

  Priyadarshi, A ^a,b   Fen, L H ^a   Mhaisalkar, S G ^a   Kripesh, V ^b,d,e   Asundi, A K ^c,f,g,h  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d IEEE

^e Singapore Chapter   (Singapore)

^f NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^g SPIE ^*  (Singapore)

^h Photonics Association   (Singapore)

Author keywords

Adhesive joint; FEA; Micro moir interferometry; Misalignment; Silicon optical bench; Single fiber; Thermal stress; V groove

Indexed keywords

ADHESIVE JOINTS; ANISOTROPY; ETCHING; FIBER OPTICS; FINITE ELEMENT METHOD; INTERFEROMETRY; PARAMETER ESTIMATION; SEMICONDUCTING SILICON; SILICON; THERMAL STRESS;

MICRO MOIRÉ INTERFEROMETRY; MISALIGNMENT; SILICON OPTICAL BENCH; SINGLE FIBER; V-GROOVE;

LIGHT MODULATION;

EID: 33644979883     PISSN: 10685200     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.yofte.2005.07.003     Document Type: Article

References (22)

1. J.M. Verdiell, and G.H. Wiseman New approach to component-level packaging for 10 Gbps optical technologies Intel Develop. Update Mag. 2002 1 6
2. D. Ruxton, and B. Ashby Package deals SPIE OE Mag. 2003 26 28
3. A.R. Mickelson, R.B. Nagesh, and Y.-C. Lee Optoelectronic Packaging 1997 Wiley New York
4. A.R. Faidz, H. Ghafouri-Shiraz, K. Takahashi, and H.T. Chuah Analysis of combined ball lens and conically lensed fiber scheme to improve the coupling efficiency and misalignment tolerance between laser diodes and single mode fibers J. Opt. Commun. 22 3 2001 82 86
5. M. Takahshi, T. Ido, and T. Nagara A polymer PLC platform with a fiber-alignment V-groove for a low-cost 10-GbE WWDM transmitter IEEE Photon. Technol. Lett. 16 1 2004 266 268
6. T. Bricheno, H.F.M. Priddle, R.G. Peall, D. Spear, Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology, in: Opt. Fiber Commun. Conf. Ser. Tech. Dig., vol. 2, 1998, paper ThS4
7. D.C. Abeysinghe, V. Ranatunga, A. Balagopal, H. Mu, K. Ye, and D. Klotzkin A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging IEEE Photon. Technol. Lett. 16 9 2004 2150 2152
8. D. Shimura, M. Uekawa, K. Kotani, Y. Maeno, H. Sasaki, T. Takamori, Silicon microlens on V-groove platform for low-cost and high-performance optical modules, in: IEEE Proceedings of 53rd Electronic Components and Technology Conference, 2003, pp. 1318-1322
9. K. Kurata, K. Yamauchi, A. Kawatani, A. Goto, N. Kimura, K. Higashikawa, S. Dohmae, H. Tanaka, and S. Ishikawa Low cost optical module packaging techniques for optical access network systems IEICE Trans. Electron. E80-C 1 1997 98 106
10. T. Qing, Y.C. Lee, Solder technology for optoelectronic packaging, in: IEEE Proceedings of 46th Electronic Components and Technology Conference, 1996, pp. 26-36
11. N. Murata, Adhesive for optical devices, in: IEEE Proceedings of 48th Electronic Components and Technology Conference, 1998, pp. 1178-1185
12. Y. Yamamada, F. Hanawa, T. Kitoh, and T. Maruno Low-loss and stable fiber-to-waveguide connection utilizing UV curable adhesive IEEE Photon. Technol. Lett. 4 1992 906 908
13. Y. Hibino, F. Hanawa, H. Nakagome, M. Ishii, and N. Takato High reliability optical splitters composed of silica-based planar lightwave circuits J. Lightwave Technol. 13 1995 1728 1735
14. D. Wu, Y.C. Lee, Reliability study of an epoxy-bonded laser-to-fiber assembly, in: IEEE Proceedings of 48th Electronic Components and Technology Conference, 1998, pp. 1186-1191
15. M. Derosa, and S. Logunov Photothermal behavior of an optical path adhesive used for photonics applications at 1550 nm Appl. Opt. 40 2001 6611 6617
16. M.A. Uddin, H.P. Chan, K.W. Lam, Y.C. Chan, P.L. Chu, K.C. Hung, and T.O. Tsun Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging IEEE Photon. Technol. Lett. 16 2004 1113 1115
17. Y. Lin, W. Liu, F.G. Shi, Adhesive for optical devices, in: IEEE Proceedings of 52nd Electronic Components and Technology Conference, 2002, pp. 1178-1185
18. W.H. Cheng, M.T. Sheen, C.P. Chien, H.L. Chang, and J.H. Kuang Reduction of Fiber Alignment Shifts in Semiconductor Laser Module Packaging J. Lightwave Technol. 18 6 2000 842 848
19. ANSYS modeling and meshing guide: ANSYS release 6.0, ANSYS Inc., 2001
20. D. Post, B. Han, and P. Ifju High Sensitivity Moire: Experimental Analysis for Mechanics and Materials 1994 Springer-Verlag New York
21. E.J. Murphy Fiber Attachment for guided wave device J. Lightwave Technol. 6 1988 862 871
22. M. Rassaian, and M.W. Beranek Quantitative characterization of 96.5Sn3.5Ag and 80Au20Sn optical fiber solder bond joints on silicon micro-optical bench substrates IEEE Trans. Adv. Pack. 22 1999 86 93