Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology

Conference on Optical Fiber Communication, Technical Digest Series

Volumn 1998-January, Issue , 1998, Pages 349-350

  Bricheno, T ^a   Priddle, H F M ^a   Peall, R G ^a   Spear, D ^a  

^a NORTEL NETWORKS   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

OPTICAL FIBER COUPLING; OPTOELECTRONIC DEVICES; SEMICONDUCTING SILICON; SUBSTRATES;

SILICON V GROOVE PLATFORMS;

ELECTRONICS PACKAGING;

EID: 0031650166     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. R. Cann, P.M. Harrison, D. Spear, Proc. SPIE 3004, (1997).
2. R.G. Peall et al., Electron Lett. 32,682-683 (1996).
3. R.G. Peall etal., Electron Lett. 33, 1250-1252 (1997).