A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging

IEEE Photonics Technology Letters

Volumn 16, Issue 9, 2004, Pages 2150-2152

  Abeysinghe, Don C ^a,b   Ranatunga, Vipul ^c   Balagopal, Ajit ^b   Mu, Haichuan ^b   Ye, Kuntao ^b   Klotzkin, David ^b  

^a IEEE   (United States)

^b UNIVERSITY OF CINCINNATI   (United States)

^c MIAMI UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; FIBER ATTACHMENT; OPTOELECTRONICS PACKAGING;

ALIGNMENT; BONDING; COST EFFECTIVENESS; ELECTRONICS PACKAGING; OPTICAL FIBER COUPLING; SILICA;

OPTOELECTRONIC DEVICES;

EID: 4444366284     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2004.833095     Document Type: Article

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