Silicon microlens on V-groove platform for low-cost and high-performance optical modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1318-1322

  Shimura, Daisuke ^a   Uekawa, Masahiro ^a   Kotani, Kyoko ^a   Maeno, Yoshinori ^a   Sasaki, Hironori ^a   Takamori, Takeshi ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; DISTRIBUTED FEEDBACK LASERS; OPTICAL DEVICES; SEMICONDUCTING SILICON; SEMICONDUCTOR LASERS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; WAVEGUIDE ISOLATORS;

DISTRIBUTED FEEDBACK LASER DIODES; OPTICAL MODULES; SILICON MICROLENS; V-GROOVE SUBSTRATE;

MICROLENSES;

EID: 0038688785     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. Tanaka, S. Sasaki, G. Nakagawa, T. Yamamoto, K. Miura, S. Ogita and M. Yano, "High optical coupling scheme in LD modules with silicon platform technology", IEICE Trance. Electron. E80-C, pp. 107-111, 1997.
2. G.J. Swanson, "Binary optics technology: The theory and design of multi-level diffractive optical elements", MIT technical Report 854, 1989
3. R.R. A Syms, C. Gormley and S. Blackstone, "Surface tension powered self-assembly of 3D MOEMS devices using DRIE of bonded silicon-on-insulator wafers", IEE Seminar on "Demonstrated micromachining techniques for industry", ser. Tech. Dig., 2000.
4. Hironori Sasaki, Masahiro Uekawa, Kyoko Kotani, Daisuke Shimura, Yoshinori Maeno and Takeshi Takamori, "Integration of silicon microlenses to light sources for datacom and telecom applications", Proceedings of SPIE 4870, pp. 471-479, 2002.
5. J. B. Breedis, "Monte Carlo tolerance analysis of a passively aligned silicon waferboard package", Electric Components and Technology Conference, ser. Tech. Dig., s07p6, 2001.