Reduction of fiber alignment shifts in semiconductor laser module packaging

Journal of Lightwave Technology

Volumn 18, Issue 6, 2000, Pages 842-848

  Cheng, Wood Hi ^{a,b,c,d,e,f,g,h,i,j}   Sheen, Maw Tyan ^c   Chien, Chih Pen ^c   Chang, Hung Lun ^d   Kuang, Jao Hwa ^c  

^a IEEE   (Taiwan)

^b OSA ^*

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^d CHUNGHWA TELECOM CO LTD   (Taiwan)

^e OKLAHOMA STATE UNIVERSITY   (United States)

^f TACAN Corporation   (United States)

^g Rockwell International   (United States)

^h General Optronics   (United States)

ⁱ CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

^j OPTICAL SOCIETY OF AMERICA   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

FIBER ALIGNMENT SHIFT; FIBER SOLDER FERRULE JOINT; FIBER SOLDERING PROCESS;

ELECTRONICS PACKAGING; FIBER OPTICS; FINITE ELEMENT METHOD; RESIDUAL STRESSES; STRESS CONCENTRATION; THERMAL CYCLING; THERMAL STRESS;

SEMICONDUCTOR LASERS;

EID: 0033717706     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/50.848395     Document Type: Article

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