Low cost optical module packaging techniques for optical access network systems

IEICE Transactions on Electronics

Volumn E80-C, Issue 1, 1997, Pages 98-105

  Kuratai, Kazuhiko ^a   Yamauchit, Kenji ^a   Kawatanlt, Atsuhiro ^a   Gotot, Akio ^a   Kimurai, Naoki ^a   Higashikawai, Kimikazu ^a   Dohmaeit, Satoshi ^a   Tanakaii, Hideki ^a   Ishikawai, Shigeta ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Optical access network; Optical module; Packaging techniques; Passive alignment

Indexed keywords

ALIGNMENT; FIBER OPTIC NETWORKS; OPTICAL FIBERS; OPTICAL LINKS; OPTICAL WAVEGUIDES; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR LASERS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

HYBRID INTEGRATED WAVEGUIDE MODULES; OPTICAL ACCESS NETWORKS; OPTICAL MODULES; PASSIVE ALIGNMENT TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0030678416     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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