Quantitative characterization of 96.5sn3.5ag and 80au20sn optical fiber solder bond joints on silicon micro-optical bench substrates

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 1, 1999, Pages 86-93

  Rassaian, Mostafa ^a   Beranek, Mark W ^a  

^a NONE

Author keywords

80au20sn; 96.5sn3.5ag; Fiber optics; Finite element analysis; Optical bench; Optical fiber; Silicon; Soldering; Strain; Stress

Indexed keywords

EID: 0001913816     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.746547     Document Type: Article

References (29)

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