Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging

IEEE Photonics Technology Letters

Volumn 16, Issue 4, 2004, Pages 1113-1115

  Uddin, M A ^a   Chan, H P ^a   Lam, K W ^a   Chan, Y C ^a   Chu, P L ^a   Hung, K C ^b   Tsun, T O ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Photonics Manufacturing Services Ltd   (Hong Kong)

Author keywords

Bonding; Delamination; Optical propagation; Packaging; Reliability; Shadowing; V groove

Indexed keywords

ADHESIVES; BONDING; CURING; DELAMINATION; INTERFACES (MATERIALS); LIGHT PROPAGATION; LIGHT REFLECTION; LIGHT TRANSMISSION; RAY TRACING; RELIABILITY; SCANNING ELECTRON MICROSCOPY;

PHOTONIC PACKAGING; ULTRAVIOLET ADHESIVES;

OPTICAL FIBERS;

EID: 1942532775     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2004.824639     Document Type: Article

References (7)

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