Wafer scale patterning by soft UV-nanoimprint lithography

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 167-171

  Plachetka, U ^a   Bender, M ^a   Fuchs, A ^a   Vratzov, B ^a   Glinsner, T ^b   Lindner, F ^b   Kurz, H ^a  

^a AMO GMBH   (Germany)

^b EV GROUP   (Austria)

Author keywords

Nanoimprint; Patterning on wafer scale; Soft lithography; UV Nanoimprint

Indexed keywords

LITHOGRAPHY; METAL CASTINGS; MOLDING; ULTRAVIOLET RADIATION; VISCOSITY; WSI CIRCUITS;

NANOIMPRINT; PATTERNING ON WAFER SCALE; SOFT LITHOGRAPHY; UV-NANOIMPRINT;

MICROELECTRONICS;

EID: 14944343758     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00093-0     Document Type: Conference Paper

References (8)

1. Xia Y., Whitesides G.M. Annu. Rev. Mater. Sci. 28:1998;153.
2. Libioulle L., Bietsch A., Schmid H., Michel B., Delamarche E. Langmuir. 15:1999;300.
3. Bender M., Otto M., Hadam B., Vratzov B., Spangenberg B., Kurz H. Microelectron. Eng. 53:2000;233.
4. Colburn M., Johnson S., Stewart M., Damle S., Bailey T., Choi B., Wedlake M., Michaelson T., Sreenivasan S.V., Ekerdt J.G., Willson C.G. Proc. SPIE. 3676(I):1999;379.
5. Colburn M., Grot A., Amistoso M., Choi B.J., Bailey T., Ekerdt J., Sreenivasan S.V., Hollenhorst J., Willson C.G. Proc. SPIE. 3997:2000;453.
6. Otto M., Bender M., Hadam B., Spangenberg B., Kurz H. Microelectron. Eng. 57-58:2001;361-366.
7. Bender M., Otto M., Hadam B., Spangenberg B., Kurz H. Microelectron. Eng. 61-62:2002;407-413.
8. Efimenko K., Wallace W.E., Genzer J. J. Colloid Interf. Sci. 254:2002;306.