Thermal characterization of pulse-activated microelectronic devices by thermoreflectance-based surface temperature scanning

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1413-1420

  Komarov, Pavel L ^a   Burzo, Mihai G ^a   Raad, Peter E ^a  

^a Southern Methodist University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA ACQUISITION; REFLECTION; SILICON; SURFACE CHEMISTRY; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

ISOTOPICALLY-PURE SILICON; MICROSECOND TEMPORAL RESOLUTION; SURFACE REFLECTIVITY;

MICROELECTRONICS;

EID: 32844463053     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73196     Document Type: Conference Paper

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