Real time sub-micron thermal imaging using thermoreflectance

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 369, Issue 7, 2001, Pages 231-235

  Christofferson, James ^a   Vashaee, Daryoosh ^a   Shakouri, Ali ^a   Melese, Philip ^b  

^a University of California Santa Cruz   (United States)

^b SRI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICRO-HEATERS; SEMICONDUCTOR MICRO-COOLERS;

CAMERAS; FREQUENCY DOMAIN ANALYSIS; HEAT RADIATION; INTEGRATED CIRCUITS; OPTOELECTRONIC DEVICES; SEMICONDUCTOR DEVICES; THERMAL EFFECTS;

INFRARED IMAGING;

EID: 1542747901     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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2. K.E. Goodson and Y.S. Ju, "Short-time-scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique," Trans. of the ASME, p.306-313, May 1998.
3. Quintard, Dilhaire, Phan, and Claeys. "Temperature Measurement of Metal Lines under Current Stress by High Resolution Laser Probing," IEEE Trans. on Instrumentation and Measurement, p.69-74, Feb 1999.
4. J. Batista, A Mansanares, EC DaSilva, M Pimentel, N Januzzi, D Fournier. "Subsurface Microscopy of Biased Metal Oxide Semiconductor Field Effect Transistor Structures: Photothermal and Electroreflectance images," Senors and Actuators A, 71:40-45, 1998.
5. A Mansanares, D Fournier, A Boccara. "Temperature Measurements of Telecommunication Lasers on a Micrometre Scale", Electronics Letters, 29(23), p.2045-2047, 1993.
6. S Grauby, S Hole and D Fournier. "High Resolution Photothermal Imaging of High Frequency Using Visible Charge Couple Device Camera Associated with Multichannel Lock-in Scheme," Review of Scientific Instruments. P.3603-3608, Sept. 1999.
7. Garfinkel, Tiemenn, Engler, "Piezoreflectivity of the Nobel Metals", Physical Review, August 1966.
8. Ali Shakouri and John E. Bowers, "Heterostructure Integrated Thermoinic Micro-Coolers," Applied Physics Letters, 9(71), p. 1234-1236, September 1997.
9. Xiaofeng Fan, Gehong Zeng, Chris LaBounty, Daryoosh Vashaee, James Christofferson, Ali Shakouri, and John E. Bowers, "Integrated Cooling for Si-based Microelectronics," Proceedings of 20th International Conference on Thermoelectrics, Beijing, P.R.China 8-11th June 2001, to be published.