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Volumn 48, Issue 1, 1999, Pages 69-74

Temperature measurements of metal lines under current stress by high-resolution laser probing

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; CURRENT DENSITY; ELECTRIC LINES; ELECTROMIGRATION; INTERCONNECTION NETWORKS; INTERFEROMETRY; LASER APPLICATIONS; PROBES; STRESS ANALYSIS; THERMAL CONDUCTIVITY OF SOLIDS;

EID: 0032673011     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/19.755063     Document Type: Article
Times cited : (29)

References (9)
  • 1
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    • Simulation and testing of temperature distribution and resistance versus power for SWEAT and related Joule-heating metal on insulator structures
    • New Orleans, LA
    • C. R. Crowell, C. C. Shih, and V. Tyree, "Simulation and testing of temperature distribution and resistance versus power for SWEAT and related Joule-heating metal on insulator structures," in Proc. 28th Int. Reliability Physics Symp., New Orleans, LA, 1990, pp. 37-413.
    • (1990) Proc. 28th Int. Reliability Physics Symp. , pp. 37-413
    • Crowell, C.R.1    Shih, C.C.2    Tyree, V.3
  • 2
    • 0027064164 scopus 로고
    • Finite element analysis of a SWEAT structure with a 3D, nonlinear, coupled thermal-electric model
    • Mar.
    • M. J. Dion, "Finite element analysis of a SWEAT structure with a 3D, nonlinear, coupled thermal-electric model," in IEEE Int. Conf. Microelectronic Test Structures, Mar. 1992, vol. 5, pp. 12-17.
    • (1992) IEEE Int. Conf. Microelectronic Test Structures , vol.5 , pp. 12-17
    • Dion, M.J.1
  • 3
    • 0022246522 scopus 로고
    • Wafer level electromigration tests for production monitoring
    • Orlando, FL
    • B. J. Root and T. Turner, "Wafer level electromigration tests for production monitoring," in Proc. 23rd Reliability Physics Symp., Orlando, FL, 1985, pp. 100-107.
    • (1985) Proc. 23rd Reliability Physics Symp. , pp. 100-107
    • Root, B.J.1    Turner, T.2
  • 4
    • 0027629313 scopus 로고
    • Thermoreflectance optical test probe for the measurement of current induced temperature changes in microelectronic components
    • W. Claeys, S. Dilhaire, V. Quintard, J. P. Dom, and Y. Danto, "Thermoreflectance optical test probe for the measurement of current induced temperature changes in microelectronic components," Qual. Reliab. Eng.Int., vol. 9, pp. 303-308, 1993.
    • (1993) Qual. Reliab. Eng.Int. , vol.9 , pp. 303-308
    • Claeys, W.1    Dilhaire, S.2    Quintard, V.3    Dom, J.P.4    Danto, Y.5
  • 5
    • 0028397383 scopus 로고
    • Laser probing of thermal behavior of electronic components and its application in quality and reliability testing
    • W. Claeys, S. Dilhaire, and V. Quintard, "Laser probing of thermal behavior of electronic components and its application in quality and reliability testing," Microelectron. Eng., vol. 24, pp. 411-4120, 1994.
    • (1994) Microelectron. Eng. , vol.24 , pp. 411-4120
    • Claeys, W.1    Dilhaire, S.2    Quintard, V.3
  • 7
    • 0000240531 scopus 로고    scopus 로고
    • Thermomechal study of AlCu based interconnect under pulsed thermoelectric excitation
    • T. Phan, S. Dilhaire, V. Quintard, D. Lewis, and W. Claeys, "Thermomechal study of AlCu based interconnect under pulsed thermoelectric excitation," J. Appl. Phys., vol. 81, no. 3, pp. 1157-1168, 1997.
    • (1997) J. Appl. Phys. , vol.81 , Issue.3 , pp. 1157-1168
    • Phan, T.1    Dilhaire, S.2    Quintard, V.3    Lewis, D.4    Claeys, W.5
  • 8
    • 0023312194 scopus 로고
    • Thermal analysis of electromigration test structures
    • Mar.
    • H. A. Schafft, "Thermal analysis of electromigration test structures," IEEE Trans. Electron Devices, vol. ED-34, pp. 664-672, Mar. 1987.
    • (1987) IEEE Trans. Electron Devices , vol.ED-34 , pp. 664-672
    • Schafft, H.A.1
  • 9
    • 0142201132 scopus 로고
    • Thermal conductivity of thin dielectric films and its impact on multilevel metallizations
    • A. N. Saxena and M. A. Bourgeois, "Thermal conductivity of thin dielectric films and its impact on multilevel metallizations," in VMIC Conf. ISMIC, 1993, pp. 251-257.
    • (1993) VMIC Conf. ISMIC , pp. 251-257
    • Saxena, A.N.1    Bourgeois, M.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.