Reliability evaluation of flip chip using stress intensity factors of an interface crack

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 741-747

  Kim, Won Keun ^a   Ikeda, Toru ^a   Miyazaki, Noriyuki ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CRACK PROPAGATION; DELAMINATION; FINITE ELEMENT METHOD; LIQUID CRYSTAL DISPLAYS; NUMERICAL ANALYSIS; PRINTED CIRCUIT BOARDS; RESIDUAL STRESSES; STRESS INTENSITY FACTORS; VAPOR PRESSURE; ADHESIVE JOINTS; ASPHALT PAVEMENTS; CRACKS; DISSIMILAR MATERIALS; FLEXIBLE DISPLAYS; LIQUID CRYSTALS; PACKAGING; RELIABILITY; SOLDERING;

CONDUCTIVE ADHESIVE FILM (ACF); INTERFACE CRACKS; SOLDER REFLOW PROCESS; ANISOTROPIC CONDUCTIVE ADHESIVE FILM; CHIP SIZES; CIRCUIT BOARDS; ELECTRICAL PERFORMANCE; ELECTRONIC ASSEMBLIES; ELECTRONIC PACKAGE; FLIP CHIP; FLIP-CHIP PACKAGING; INTERFACE CRACK; KEY TECHNOLOGIES; LIQUID-CRYSTAL DISPLAY PANELS; MECHANICAL RELIABILITY; OPTIMUM DESIGNS; RELIABILITY EVALUATION; SOLDER REFLOW;

FLIP CHIP DEVICES; CHIP SCALE PACKAGES;

EID: 1242331974     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35093     Document Type: Conference Paper

References (9)

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2. Ikeda, T., Arase, I., Ueno, Y. and Miyaszki, N., 1998, Strength Evaluation of V-notches in Electronic Plastic Packages Using Stress Intensity Factors of V-Notch", Proceedings of the ICES '98, Modeling and Simulation based Engineering, Vol. I, pp. 965-970
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6. Ikeda, T., Ueno, Y., Miyazaki, N. and Ito, N., 2001, Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow Process," J. of Japan Institute of Electronics Packaging, 4-1, pp. 47-55
7. Rice, J. R., 1988, iElastic Fracture Mechanics Concepts for Interfacial Crack," Trans. of ASME Series E, J. of Applied Mechanics, 55, pp. 98-103
8. Wang, J.S. and Suo, Z., 1990, "Experimental Determination of Interfacial Toughness Curves using Brazil-nut-sandwiches," Acta Metall. Mater., 38-7. pp. 1279-1290.
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