Determination of measurement limit for open solder bumps on a flip-chip package using a laser ultrasonic inspection system

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 1, 2006, Pages 178-185

  Erdahl, Dathan S ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Error ratio; Flip chip devices; Inspection; Integrated circuit testing; Laser ultrasound; Light interferometry; Nondestructive testing; Open bumps; Pulsed laser; Quality control; Solder bump inspection; Ultrasonic applications; Vibration displacement

Indexed keywords

FLIP CHIP DEVICES; INSPECTION; INTEGRATED CIRCUIT TESTING; INTERFEROMETRY; NONDESTRUCTIVE EXAMINATION; PULSED LASER APPLICATIONS; QUALITY CONTROL; SOLDERING; STATISTICAL METHODS; ULTRASONIC APPLICATIONS; VIBRATIONS (MECHANICAL);

ERROR RATIO; LASER ULTRASONIC INSPECTION SYSTEM; LASER ULTRASOUND; LIGHT INTERFEROMETRY; OPEN BUMPS; SOLDER BUMP INSPECTION; VIBRATION DISPLACEMENT;

CHIP SCALE PACKAGES;

EID: 32444447332     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.850508     Document Type: Article

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