Further investigation into the use of acoustic micro imaging for analyzing flip chip integrity and failure modes

Proceedings of SPIE - The International Society for Optical Engineering

Volumn , Issue , 1997, Pages 165-169

  Semmens, Janet E ^a   Kessler, Lawrence W ^a  

^a Sonoscan Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; CRYSTAL DEFECTS; INTEGRATED CIRCUIT TESTING; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); NONDESTRUCTIVE EXAMINATION; SOLDERED JOINTS; SUBSTRATES; ULTRASONIC IMAGING;

SCANNING ACOUSTIC MICROSCOPES;

FLIP CHIP DEVICES;

EID: 0031378960     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)