Inspection of flip chip and chip scale package interconnects using laser ultrasound and interferometric techniques

International Journal of Microcircuits and Electronic Packaging

Volumn 25, Issue 1, 2005, Pages 1-14

  Howard, Turner ^a   Erdahl, Dathan ^a   Ume, I Charles ^a   Gamalski, Juergen ^b   Achari, Achyuta ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b SIEMENS AG   (Germany)

^c VISTEON CORPORATION   (United States)

Author keywords

And Interferometry; Chip Scale Package; Flip Chip; Inspection; Laser Ultrasound; Solder Joint Reliability

Indexed keywords

ACOUSTIC MICRO-IMAGING; AND INTERFEROMETRY; AUTOMATED OPTICAL INSPECTION; AUTOMATED X-RAY INSPECTIONS; CHIP SCALE; COEFFICIENT OF THERMAL EXPANSION; DEFECT-FREE; FLIP CHIP; GEORGIA; HIGH-SENSITIVITY; INSPECTION METHODS; INSPECTION SYSTEM; INSPECTION TECHNIQUE; INTERFEROMETRIC TECHNIQUES; LASER ULTRASOUND; LEAD-FRAME; LONG-TERM GOALS; MECHANICAL INTEGRITY; MICROELECTRONIC COMPONENTS; MICROELECTRONICS MANUFACTURING; NON DESTRUCTIVE; NON DESTRUCTIVE INSPECTION; NON-CONTACT; NON-WETTED; NOVEL APPLICATIONS; ON-LINE INSPECTION; OUT-OF-PLANE; PACKAGE INTERCONNECTS; PROCESS DEVELOPMENT; PROTOTYPE SYSTEM; PULSED LASER; SIGNAL PROCESSING TECHNIQUE; SILICON CHIP; SOLDER BALLS; SOLDER BUMP; SOLDER JOINT RELIABILITY; SOLDER JOINTS; TESTED DEVICES; VIBRATION RESPONSE; VIBRATION SIGNATURE; WAFER-LEVEL CHIP SCALE PACKAGES; WARPAGE;

ACOUSTIC WAVES; AUTOMATION; BRAZING; CHIP SCALE PACKAGES; FAILURE ANALYSIS; INSPECTION; INTERFEROMETERS; INTERFEROMETRY; LASERS; LEAD; MICROELECTRONIC PROCESSING; MICROELECTRONICS; OPTICAL TESTING; PULSED LASER APPLICATIONS; QUALITY ASSURANCE; SAFETY FACTOR; SIGNAL PROCESSING; SILICON WAFERS; SUBSTRATES; SURFACE DEFECTS; THERMAL EXPANSION; ULTRASONIC IMAGING; ULTRASONICS; WELDING;

ULTRASONIC APPLICATIONS;

EID: 10444248461     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Timothy W. Ellis, "Bond Integrity: Trade-Offs Between Electrical, Thermal and Mechanical Performance", Chip Scale Review, August-September, 2001.
2. Stuart Wright, "X-Ray Inspection of IC Packages and PWBs", Chip Scale Review, August-September, 2001.
3. Tom Adams, "Online Inspection for Hidden Internal Defects", Sensors, pp. 56-61, April, 2000.
4. J. P. Monchalin, "Measurement of In-Plane and Out-of-Plane Ultrasonic Displacements by Optical Heterodyne Interferometry", Journal of Nondestructive Evaluation, Vol. 8, No. 2,1989.
5. Sheng Liu, Dathan Erdahl, I. Charles Ume, "Vibration Analysis Based Modeling and Defects Recognition for Flip Chip Solder Joint Inspection", Proceedings of the ASME International Mechanical Engineering Congress & Exposition (IMECE), Orlando, Florida, November 5-10, 2000.
6. Sheng Liu, Dathan Erdahl, I. Charles Ume, . "A Novel Method and Device for Solder Joint Quality Inspection by Using Laser Ultrasound." Proceedings of the 50th Electronic Components & Technology Conference (ECTC), Las Vegas, Nevada, May 24-26, pp. 408-415,2000.
7. Sheng Liu, "Defects Pattern Recognition for Flip Chip Solder Joint Quality Inspection", Proceedings of the 52nd Electronic Components and Technology Conference (ECTC), San Diego, California, May 28-31, 2002.
8. John H. Lau, CatherineA. Keely, "Dynamic Characterization of Surface-Mount Component Leads for Solder Joint Inspection", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, pp. 594-602, December, 1989.
9. Sheng Liu, Dathan ErdahJ, I. Charles Ume, "A Novel Approach for Flip Chip Solder Joint Quality Inspection: Laser Ultrasound and Interferometric System", IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 616-624, December, 2001.