-
1
-
-
0003624189
-
-
Knopf, New York
-
E. Tenner, Why Things Bite Back: Technology and the Revenge of Unintended Consequences, Knopf, New York, 1996. See also L. Wiener, Digital Woes: Why We Should Not Depend on Software, Addison-Wesley, Reading, Mass., 1993.
-
(1996)
Why Things Bite Back: Technology and the Revenge of Unintended Consequences
-
-
Tenner, E.1
-
2
-
-
0012330584
-
-
Addison-Wesley, Reading, Mass.
-
E. Tenner, Why Things Bite Back: Technology and the Revenge of Unintended Consequences, Knopf, New York, 1996. See also L. Wiener, Digital Woes: Why We Should Not Depend on Software, Addison-Wesley, Reading, Mass., 1993.
-
(1993)
Digital Woes: Why We Should Not Depend on Software
-
-
Wiener, L.1
-
3
-
-
0001343814
-
Monolithic Geared-Mechanisms Driven by a Polysilicon Surface-Micromachined On-Chip Electrostatic Microengine
-
J.J. Sniegowski et al., "Monolithic Geared-Mechanisms Driven by a Polysilicon Surface-Micromachined On-Chip Electrostatic Microengine," Proc. Solid-State Sensor and Actuator Workshop, 1996, pp. 178-182.
-
(1996)
Proc. Solid-State Sensor and Actuator Workshop
, pp. 178-182
-
-
Sniegowski, J.J.1
-
5
-
-
0344152178
-
Future Technology Challenges for Failure Analysis
-
ASM Int'l, Materials Park, Oh.
-
R.E. Anderson, J.M. Soden, and C.L. Henderson, "Future Technology Challenges for Failure Analysis," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, Materials Park, Oh., 1995, pp. 27-32. See also J.M. Soden and R.E. Anderson, "IC Failure Analysis: Techniques and Tools for Quality and Reliability Improvement," Proc. IEEE, Vol. 81, No. 5, May 1993, pp. 703-715.
-
(1995)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 27-32
-
-
Anderson, R.E.1
Soden, J.M.2
Henderson, C.L.3
-
6
-
-
0027593771
-
IC Failure Analysis: Techniques and Tools for Quality and Reliability Improvement
-
May
-
R.E. Anderson, J.M. Soden, and C.L. Henderson, "Future Technology Challenges for Failure Analysis," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, Materials Park, Oh., 1995, pp. 27-32. See also J.M. Soden and R.E. Anderson, "IC Failure Analysis: Techniques and Tools for Quality and Reliability Improvement," Proc. IEEE, Vol. 81, No. 5, May 1993, pp. 703-715.
-
(1993)
Proc. IEEE
, vol.81
, Issue.5
, pp. 703-715
-
-
Soden, J.M.1
Anderson, R.E.2
-
8
-
-
0026834362
-
Imaging VLSI Cross Sections by Atomic Force Microscopy
-
IEEE, Piscataway, N.J.
-
G. Neubauer, M.L.A. Dass, and T.J. Johnson, "Imaging VLSI Cross Sections by Atomic Force Microscopy," Proc. Int'l Reliability Physics Symp., IEEE, Piscataway, N.J., 1992, pp. 299-303.
-
(1992)
Proc. Int'l Reliability Physics Symp.
, pp. 299-303
-
-
Neubauer, G.1
Dass, M.L.A.2
Johnson, T.J.3
-
9
-
-
3743151120
-
-
E. Betzig and J.K. Trautman, Science, Vol. 257, 1992, p. 189. See also H.F. Hess and E. Betzig, "Applications of Near-Field Scanning Optical Microscopy," in Semiconductor Characterization: Present Status and Future Need, AIP Press, Woodbury, N.Y., 1996, pp. 395-398.
-
(1992)
Science
, vol.257
, pp. 189
-
-
Betzig, E.1
Trautman, J.K.2
-
10
-
-
84889531417
-
Applications of Near-Field Scanning Optical Microscopy
-
AIP Press, Woodbury, N.Y.
-
E. Betzig and J.K. Trautman, Science, Vol. 257, 1992, p. 189. See also H.F. Hess and E. Betzig, "Applications of Near-Field Scanning Optical Microscopy," in Semiconductor Characterization: Present Status and Future Need, AIP Press, Woodbury, N.Y., 1996, pp. 395-398.
-
(1996)
Semiconductor Characterization: Present Status and Future Need
, pp. 395-398
-
-
Hess, H.F.1
Betzig, E.2
-
12
-
-
0037502560
-
The Use of Light Emission in Failure Analysis of CMOS ICs
-
ASM Int'l
-
C.F. Hawkins et al., "The Use of Light Emission in Failure Analysis of CMOS ICs," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1990, pp. 55-67.
-
(1990)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 55-67
-
-
Hawkins, C.F.1
-
13
-
-
84866733033
-
Infrared Light Emission from Semiconductor Devices
-
ASM Int'l
-
D.L. Barton et al., "Infrared Light Emission from Semiconductor Devices," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1996, pp. 9-17.
-
(1996)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 9-17
-
-
Barton, D.L.1
-
14
-
-
0039311611
-
IDA: A Tool for Computer-Aided Failure Analysis
-
IEEE Computer Society Press, Los Alamitos, Calif.
-
A. Noble, "IDA: A Tool for Computer-Aided Failure Analysis," Proc. Int'l Test Conf., IEEE Computer Society Press, Los Alamitos, Calif., 1992, pp. 848-853.
-
(1992)
Proc. Int'l Test Conf.
, pp. 848-853
-
-
Noble, A.1
-
15
-
-
0024902909
-
Resistive Contrast Imaging Applied to Multilevel Interconnection Failure Analysis
-
IEEE
-
E.I. Cole, Jr., "Resistive Contrast Imaging Applied to Multilevel Interconnection Failure Analysis," Proc. IEEE VLSI Multilevel Interconnection Conf., IEEE, 1989, pp. 176-182.
-
(1989)
Proc. IEEE VLSI Multilevel Interconnection Conf.
, pp. 176-182
-
-
Cole Jr., E.I.1
-
16
-
-
0026834363
-
Rapid Localization of IC Open Conductors Using Charge-Induced Voltage Alteration (CIVA)
-
IEEE
-
E.I. Cole, Jr., and R.E. Anderson, "Rapid Localization of IC Open Conductors Using Charge-Induced Voltage Alteration (CIVA)," Proc. Int'l Reliability Physics Symp., IEEE, 1992, pp. 288-298.
-
(1992)
Proc. Int'l Reliability Physics Symp.
, pp. 288-298
-
-
Cole Jr., E.I.1
Anderson, R.E.2
-
17
-
-
0028330601
-
Novel Failure Analysis Techniques Using Photon Probing with a Scanning Optical Microscope
-
IEEE
-
E.I. Cole, Jr., et al., "Novel Failure Analysis Techniques Using Photon Probing with a Scanning Optical Microscope," Proc. Int'l Reliability Physics Symp., IEEE, 1994, pp. 388-398.
-
(1994)
Proc. Int'l Reliability Physics Symp.
, pp. 388-398
-
-
Cole Jr., E.I.1
-
18
-
-
0002813011
-
Low Electron Beam Energy CIVA Analysis of Passivated ICs
-
ASM Int'l
-
E.I. Cole, Jr., et al., "Low Electron Beam Energy CIVA Analysis of Passivated ICs," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1994, pp. 23-32.
-
(1994)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 23-32
-
-
Cole Jr., E.I.1
-
19
-
-
0027111086
-
Picosecond Electrical Sampling Using a Scanning Force Microscope
-
Dec.
-
A.S. Hou, F. Ho, and D.M. Bloom, "Picosecond Electrical Sampling Using a Scanning Force Microscope," Electronic Letters, Vol. 28, No. 25, Dec. 1992, pp. 2302-2303.
-
(1992)
Electronic Letters
, vol.28
, Issue.25
, pp. 2302-2303
-
-
Hou, A.S.1
Ho, F.2
Bloom, D.M.3
-
20
-
-
0030412069
-
A Novel Optical-Probing System with Submicron Spatial Resolution for Internal Diagnosis of VLSI Circuits
-
IEEE CS Press
-
K. Ozaki et al., "A Novel Optical-Probing System with Submicron Spatial Resolution for Internal Diagnosis of VLSI Circuits," Proc. Int'l Test Conf., 1996, IEEE CS Press, pp. 269-275.
-
(1996)
Proc. Int'l Test Conf.
, pp. 269-275
-
-
Ozaki, K.1
-
21
-
-
0027146747
-
Internal Current Probing of Integrated Circuits Using Magnetic Force Microscopy
-
IEEE
-
A.N. Campbell et al., "Internal Current Probing of Integrated Circuits Using Magnetic Force Microscopy," Proc. Int'l Reliability Physics Symp., IEEE, 1993, pp. 168-177.
-
(1993)
Proc. Int'l Reliability Physics Symp.
, pp. 168-177
-
-
Campbell, A.N.1
-
22
-
-
0001904106
-
Electrical Biasing and Voltage Contrast Imaging in a Focused Ion Beam System
-
ASM Int'l
-
A.N. Campbell et al., "Electrical Biasing and Voltage Contrast Imaging in a Focused Ion Beam System," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1995, pp. 33-41.
-
(1995)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 33-41
-
-
Campbell, A.N.1
-
23
-
-
0030699011
-
Effects of Focused Ion Beam Irradiation on MOS Transistors
-
IEEE
-
A.N. Campbell et al., "Effects of Focused Ion Beam Irradiation on MOS Transistors," Proc. Int'l Reliability Physics Symp., IEEE, 1997, pp. 72-81.
-
(1997)
Proc. Int'l Reliability Physics Symp.
, pp. 72-81
-
-
Campbell, A.N.1
-
25
-
-
0010619995
-
Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging
-
ASM Int'l
-
P. Tangyunyong et al., "Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1996, pp. 55-62.
-
(1996)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 55-62
-
-
Tangyunyong, P.1
-
27
-
-
0029534554
-
DDQ Testing
-
IEEE CS Press
-
DDQ Testing," Proc. Int'l Test Conf., IEEE CS Press, 1995, pp. 902-909.
-
Proc. Int'l Test Conf.
, vol.1995
, pp. 902-909
-
-
Ahuja, H.1
-
29
-
-
84889547344
-
Failure Analysis of a Half-Micron CMOS IC Technology
-
ASM Int'l
-
A.Y. Liang et al., "Failure Analysis of a Half-Micron CMOS IC Technology," Proc. Int'l Symp. Testing and Failure Analysis, ASM Int'l, 1996, pp. 149-158.
-
(1996)
Proc. Int'l Symp. Testing and Failure Analysis
, pp. 149-158
-
-
Liang, A.Y.1
-
31
-
-
0000738845
-
Defect Classes - An Overdue Paradigm for CMOS IC Testing
-
C.F. Hawkins et al., "Defect Classes - An Overdue Paradigm for CMOS IC Testing," Proc. Int'l Test Conf., 1994, pp. 413-425.
-
(1994)
Proc. Int'l Test Conf.
, pp. 413-425
-
-
Hawkins, C.F.1
-
32
-
-
0029531720
-
Finding Defects with Fault Models
-
IEEECS Press
-
R.C. Aitken, "Finding Defects with Fault Models," Proc. Int'l Test Conf., IEEECS Press, 1995, pp. 498-505.
-
(1995)
Proc. Int'l Test Conf.
, pp. 498-505
-
-
Aitken, R.C.1
-
33
-
-
0030241924
-
Identifying Defects in Deep-Submicron CMOS ICs
-
Sept.
-
J.M. Soden, C.F. Hawkins, and A.C. Miller, "Identifying Defects in Deep-Submicron CMOS ICs," IEEE Spectrum, Sept. 1996, pp. 66-71.
-
(1996)
IEEE Spectrum
, pp. 66-71
-
-
Soden, J.M.1
Hawkins, C.F.2
Miller, A.C.3
-
36
-
-
0026985199
-
DDQ Test Vectors
-
Dec.
-
DDQ Test Vectors," J. Electronic Testing: Theory and Applications, Vol. 3, No. 4, Dec. 1992, pp. 349-357.
-
(1992)
J. Electronic Testing: Theory and Applications
, vol.3
, Issue.4
, pp. 349-357
-
-
Mao, W.1
Gulati, R.K.2
-
38
-
-
0030399873
-
DDQ Testing: Issues Present and Future
-
Winter
-
DDQ Testing: Issues Present and Future," IEEE Design & Test of Computers, Vol. 13, No. 4, Winter 1996, pp. 61-65.
-
(1996)
IEEE Design & Test of Computers
, vol.13
, Issue.4
, pp. 61-65
-
-
Soden, J.M.1
Hawkins, C.F.2
|