Application of acoustic frequency domain imaging for the evaluation of advanced micro electronic packages

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1735-1740

  Semmens, Janet E ^a   Kessler, Lawrence W ^a  

^a Sonoscan Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; ELECTRONICS PACKAGING; FOURIER TRANSFORMS; MICROELECTRONICS;

ACOUSTIC FREQUENCY; ACOUSTIC MICRO-IMAGING; FREQUENCY DOMAINS; INTERNAL FEATURES; MICROELECTRONIC PACKAGE; MICROELECTRONIC PACKAGING; RESOLUTION LIMITS; TIME DOMAIN IMAGES;

FREQUENCY DOMAIN ANALYSIS;

EID: 1842831860     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00222-6     Document Type: Conference Paper

References (4)

1. L.W. Kessler, "Acoustic Microscopy" in Metals Handbook, Ninth Edition, Vol. 17 - Nondestructive Evaluation and Quality Control - ASM International, Materials Park, OH, 1989, pp. 465-482.
2. J. E. Semmens, and L.W. Kessler, "Application Of Acoustic Micro Imaging For The Evaluation Of Advanced Microelectronic Packaging: An Overview Of Experiences From 1973 - 1996", Proceedings of ISEPT '96 conference, Shanghai, China 1996.
3. th Electronic Components and Technology Conference (ECTC), San Diego, CA, June 1-4, 1999
4. J.E. Semmens, "Flip Chips and Acoustic Micro Imaging: An Overview of Past Applications, Present Status, And Roadmap for the Future", Proceedings of ESREF conference, Dresden, Germany, Oct. 2000.