Characterisation of Chip-on-Board and Flip Chip packaging technologies by acoustic microscopy

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1803-1806

  Lawton, W ^a   Barrett, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; INTEGRATED CIRCUITS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MICROSCOPIC EXAMINATION; RELIABILITY; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE;

CHIP ON BOARD PACKAGING TECHNOLOGY; FLIP CHIP PACKAGING TECHNOLOGY; SCANNING ACOUSTIC MICROSCOPY (SAM); CHIP ON BOARD (COB) DEVICES;

ELECTRONICS PACKAGING;

EID: 0030274016     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00201-6     Document Type: Article

References (2)

1. J. Barrett, W. Lawton, et al. A review of glob top encapsulation methods for non standard chip-on-board applications, Proc. of Adhesives in Electronics, pp 370-377, (1994).
2. G. O'Malley et al. The importance of material selection for flip chip on board assemblies, IEEE Trans. on Components, Packaging and Manufacturing Technology, pp 248-255, (1994).