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Volumn 45, Issue 2 A, 2006, Pages 919-925
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A comparison of Al2O3/HfO2 and Al 2O3/ZrO2 bilayers deposited by the atomic layer deposition method for potential gate dielectric applications
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Author keywords
Al2O 3 ZrO2; Al2O3 HfO2; ALD; Bilayer; EOT; Gate oxide; Leakage current
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Indexed keywords
ALUMINUM COMPOUNDS;
BAND STRUCTURE;
DEPOSITION;
DIELECTRIC PROPERTIES;
ELECTRIC POTENTIAL;
LEAKAGE CURRENTS;
AL2O 3/ZRO2;
AL2O3/HFO2;
ALD;
BILAYER;
EOT;
GATE OXIDE;
THIN FILMS;
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EID: 32244448616
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.45.919 Document Type: Article |
Times cited : (14)
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References (17)
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