Advanced wiring RC delay issues for sub-0.25-micron generation CMOS

Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998

Volumn 1998-June, Issue , 1998, Pages 62-64

  Stamper, A K ^a   Fuselier, M B ^a   Tian, X ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CMOS INTEGRATED CIRCUITS; COPPER; DIELECTRIC MATERIALS;

BACK END OF THE LINES; CROSSTALK NOISE; DAMASCENE PROCESSING; DESIGN FLEXIBILITY; INTER-METAL DIELECTRICS; RC DELAY;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 34250671628     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1998.704752     Document Type: Conference Paper

References (8)

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