Low dielectric constant materials for interlayer dielectric applications

Solid State Technology

Volumn 39, Issue 3, 1996, Pages 83-90

  Murarka, Shyam P ^{a,b,c,d,e,f,g}  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b DR B R AMBEDKAR UNIVERSITY   (India)

^c UNIVERSITY OF MINNESOTA   (United States)

^d Dept of Mat Sci and Engineering ^*

^e Ctr Intgd Electronics E

^f New York Sematech Ctr Excellence M

^g IEEE

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; DIELECTRIC MATERIALS; HARDNESS; MATERIALS SCIENCE; PERMITTIVITY; SOLUBILITY; TENSILE STRENGTH; THERMODYNAMIC STABILITY;

INTERLAYER DIELECTRIC MATERIALS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0002157434     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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