In situ x-ray microscopic observation of the electromigration in passivated Cu interconnects

Applied Physics Letters

Volumn 78, Issue 13, 2001, Pages 1936-1938

  Schneider, G ^a   Hambach, D ^b   Niemann, B ^b   Kaulich, B ^c   Susini, J ^c   Hoffmann, N ^d   Hasse, W ^d  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF GÖTTINGEN   (Germany)

^c EUROPEAN SYNCHROTRON RADIATION FACILITY   (France)

^d LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035952777     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1356446     Document Type: Article

References (15)

1. J. R. Lloyd, J. Phys. D 32, R109 (1999).
2. C.-K. Hu, R. Rosenberg, and K. Y. Lee, Appl. Phys. Lett. 74, 2945 (1999).
3. L. Arnaud, G. Tartavel, T. Berger, D. Mariolle, Y. Gobil, and I. Touet, Proceedings 37th International Reliability Physics Symposium 1999. San Diego, 1999.
4. J. T. Lau, J. A. Prybyla, and S. K. Theiss, Appl. Phys. Lett. 76, 164 (2000).
5. M.-S. Ho, I.-S. Hwang, and T. T. Tsong, Phys. Rev. Lett. 84, 5792 (2000).
6. J. D'Haen et al., Microelectron. Reliab. 39, 1617 (1999).
7. ASTM standard F 1259M-96, Annual book of ASTM standards, American Society for Testing and Materials (1996).
8. B. Kaulich et al., Appl. Phys. Lett. 75, 4061 (1999).
9. W. S. Haddad, J. E. Trebes, E. H. Anderson, R. A. Levesque, and L. Yang, Science 266, 1213 (1994).
10. J. Lehr, Optik (Stuttgart) 104, 166 (1997).
11. D. Weiß, G. Schneider, B. Niemann, P. Guttmann, D. Rudolph, and G. Schmahl, Ultramicroscopy 84, 185 (2000).
12. G. Schneider, T. Schliebe, and H. Aschoff, J. Vac. Sci. Technol. B 13, 2809 (1995).
13. D. Hambach and G. Schneider, J. Vac. Sci. Technol. B 17, 3212 (1999).
14. D. Weiß, M. Peuker, and G. Schneider, Appl. Phys. Lett. 72, 1805 (1998).
15. X. Zhang, H. Solak, F. Cerrina, B. Lai, Z. Cai, P. Illinski, D. Legnini, and W. Rodrigues, Appl. Phys. Lett. 76, 315 (2000).