Chemical mechanical planarization for Cu through-wafer interconnects

Journal of the Electrochemical Society

Volumn 153, Issue 3, 2006, Pages

  Miranda, P A ^a   Imonigie, J A ^a,b   Moll, A J ^a  

^a Boise State University   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HYDROGEN PEROXIDE; INTERCONNECTION NETWORKS; OPTIMIZATION; PH EFFECTS; SLURRIES;

CHEMICAL MECHANICAL PLANARIZATION (CMP); REMOVAL RATE; THROUGH-WATER INTERCONNECTS (TWI); WITHIN-WAFER-NONUNIFORMITY (WIWNU);

ELECTROCHEMISTRY;

EID: 32044458546     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2160434     Document Type: Article

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