Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent

Materials Research Society Symposium - Proceedings

Volumn 767, Issue , 2003, Pages 297-302

  Luo, Ying ^a   Du, Tianbao ^a   Desai, Vimal ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALKALINITY; CHEMICAL MECHANICAL POLISHING; COMPLEXATION; DISSOLUTION; OXIDATION; PH; REACTION KINETICS; SLURRIES; SURFACE PROPERTIES; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

SURFACE PLANARITY;

COPPER;

EID: 0242322615     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f6.10     Document Type: Conference Paper

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